multilayer circuit
英 [ˌmʌltɪˈleɪə ˈsɜːkɪt]
美 [ˌmʌltiˈleɪər ˈsɜːrkɪt]
网络 多层电路
双语例句
- Suitable for medium multilayer printed circuit board, computer, communication equipment, OA equipment, lead-free PCB process etc.
适合于多层PCB、计算机及外围设备、通讯设备、办公自动设备、PCB无铅制程等。 - Control Effect of Occupational Hazards in Production Project of Multilayer Printed Circuit Board
某多层线路板生产项目职业病危害控制效果评价 - Study on the Processing Technology of the Step Designed Planar Buried Resistant Microwave Multilayer Printed Circuit Board
埋电阻台阶式多层微波印制板制造技术研究微波印制电路板制造工艺及其电阻集成 - Multilayer and high density fine-pitch printed circuit board
多层和高密度细线距的印刷电路板；多层和高密度细线距的线路板 - Multilayer co-fired AlN ceramic is a type of high performance ceramic that is printed in thick film to form multilayer circuit and fired in a certain atmosphere in high temperature.
多层共烧氮化铝陶瓷是采用厚膜印刷的方式将多层的电路金属化做入氮化铝基板并在特定气氛中高温烧结的一种高性能陶瓷。 - The fabrication procedure of two kinds of microwave multilayer printed circuit board filled with ceramic particles is briefly introduced.
简单介绍两种陶瓷粉填充微波多层印制板的制造工艺流程。 - Study on the Technics of the Pressing of Microwave Multilayer Printed Circuit Board/ Ceramic Particle Filled Laminates
微波多层印制板层压工艺技术研究 - High Density Multilayer Printed Circuit Board Produce Process Mesne Quality Manage Simple Discuss
高密度多层印制电路板生产过程中的品质管理浅议 - This development of build up-type multilayer PWB is supported by HDI materials 'technology, as well as processing technology for fine-pitch circuit formation and fine-via formation.
HDI材料技术、细间距电路形成和微导通孔形成的加工技术支持了积层多层板的开发。 - Black oxidation technology for copper in multilayer printed circuit board was introduced.
介绍了多层印制线路板内层铜墙表面的黑氧化技术。 - Tin Plating Protective Technology in Production of Multilayer Printed Circuit Board
多层印制板生产中的电镀锡保护技术 - Multilayer piezoelectric power supply is composed of a multilayer piezoelectric stack, a charging circuit and a DC/ DC transformer.
多层压电电源主要由多层压电叠堆、充电电路和DC／DC变换器组成。 - A multilayer structure is adopted resulting in compact circuit layout and reduced parasitic parameters, the voltage and current stresses on switches as well as the EMI of the circuit are significantly reduced.
该模块采用多层布线的叠层结构，电路设计紧凑，减小了分布参数，使电路工作时的电压和电流应力明显减小，从而提高了电路的性能，并降低了电磁干扰。 - Automatic Routing for the Wiring of Multilayer Printed Circuit Board DBX 2
多层印制底板自动布线系统DBX2 - Study on the Manufacturing Technology of the Buried/ Blind Via Multilayer Printed Circuit Board
埋/盲孔多层印制板制造技术研究 - The Technology of Laminating of Multilayer Printed Circuit Board and the Methods of Decreasing the Warp
多层印制板层压工艺及减少翘曲产生的方法 - Automatic routing system of multilayer print circuit board implemented on Microcomputer
在微机上实现的多层印制板自动布线系统 - Black oxidation for copper in multilayer printed circuit boards
多层印制线路板内层铜的黑氧化 - An automatic routing program system for the wiring of multilayer printed circuit boards is presented, The system employs the iterative placement algorithm and improved Lee's routing algorithm.
此文介绍多层印制底板自动布线系统DBX2，此系统有人工布局和自动布局，布线算法有改进的李氏迷路法和最小费用布线法。 - The CAD of Multilayer Thick-Film Hybrid Circuit
厚膜多层混合电路的计算机辅助设计 - The package uses multilayer aluminum nitride ( AIN) substrates, flipped monolithic microwave integrated circuit ( MMIC) chips, coplanar waveguide transmission lines, and solderless fuzz button interconnections.
文中介绍的组件使用了多层AlN基板、倒装单片微波集成电路芯片（MMIC）、共面波导传输线及无需焊接的用于互连的毛钮扣。 - Microwave Multilayer Circuit and Low Temperature Co-fire Ceramic ( LTCC)
微波多层电路与低温共烧陶瓷（LTCC） - LTCC multilayer circuit strctures require the interconnection of signals between different layers which will restrict the overal performance of the circuit systems. This is of key importance in the design of LTCC circuit systems.
LTCC多层电路结构要求实现信号的层间互连，互连的效果制约着电路系统的整体性能，是LTCC电路系统设计中的关键。 - A re-configurable filter based on microwave multilayer circuit is designed in this paper in order to satisfy the demand of microwave circuits and systems for multi-band frequency selection. The filter merges different methods of electric tunable filter but the conventional one has been improved and innovated.
为满足微波电路系统对多波段选频的需求，实现仪器小型化的发展趋势，本文设计了基于微波多层电路的可重构滤波器，融合了电调滤波器的不同实现方法，并对其进行改进创新。 - At the same time, selecting the appropriate material with silver electrode to achieve sintered at low temperatures, thus making multi-component or to passive components buried in multilayer circuit board becoming an inevitable outcome of the above-mentioned requirements.
同时选择适当的能与银等导电材料在低温下实现共烧，从而制作多层元件或把无源器件埋入多层电路基板中，成为上述趋势的必然要求。